Solution

Problem:

Equipment: Wafer Mount/Taping Machine

Feature: The wafer tape is assigned a material ID for easier verification.

Issue: When switching to a new wafer batch, wafer tape is not replaced with the corresponding BOM  number. As a result, the materials used in process do not comply with the process card instructions, leading to defective products and damaging company reputation.

Solution:

• Assign an RFID tag to each wafer tape (linked with batch number and BOM).
• Input the batch number into the MES system to retrieve the corresponding tape material number (BOM).
• RFID automatically reads the tag and verifies the tape material number.
• If a mismatch is detected, an alarm is triggered.
• The system locks the equipment until personnel review and confirm the issue.

Benefits:

By using RFID to replace manual inspection of tape specification labels inside the tape core, the cost of scrapped tape caused by verification can be reduced.
The system automatically reads and verifies the tape material number, preventing the use of incorrect tape and avoiding product scrap losses.